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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys 1/ 15 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14 ? 001 tsz02201-0j2j0a900970-1-2 02.nov.2015 rev.001 termination regulator for ddr-sdrams bd3537f general description bd353 7f is a termination regulator that complies with jedec requirements for ddr-sdram, this linear power supply uses a built-in n-channel mosfet and high -speed op-amps specially designed to provide excellent transient response. it has a sink/source current capability up to 1.8 a and has a power supply bias requirement of 5.0v for driving the n-channel mosfet. for bd3537f, ceramic capacitor can be used as output capacitor enabling significant package profile downsizing as the total regulator part. features ? incorporates a push-pull power supply for termination (vtt) ? incorporates an enabler ? incorporates an undervoltage lockout (uvlo) ? incorporates a thermal shutdown protector (tsd) ? compatible with dual channel (ddr- ii) ? incorporates soft-start function applications key specifications ? termination i np ut voltage range: 1.746v to 1.854v ? vcc input voltage range: 4.75v to 5.25v ? output current: 1.8a (max) ? high side fet on-resistance: 0. 3 (typ) ? low side fet on-resistance: 0. 3 (typ) ? standby current: 50 a (typ) ? operating temperature range: -30c to + 10 0c package w(typ) x d(typ) x h(max) power supply for ddr i/ii - sdram typical application circuit, block diagram vcc v cc vddq vtt reference block gnd vtt vtt_in tsd en uvlo uvlo tsd vcc vcc tsd en uvlo - + - + + - c 3 ref vtt_in c 2 c 1 enable block en c 4 r 1 r 2 thermal protection sop8 5.00mm x 6.20mm x 1.71mm datashee t datashee t downloaded from: http:///
2/ 15 bd3537f ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900970-1-2 02.nov.2015 rev.001 pin configuration pin descriptions description of blocks 1. vcc the vcc pin is for the independent power supply input that o perates the external circuit of the ic. it is the voltage pin that drives the ics ampl ifier circuits. the vcc input is 5v and the maximum current con sumption is 2.5ma. a bypass capacitor of 1f or so should be connected to this pin when usin g the ic in an application circuit. 2. vtt_in vtt_in is a power supply input pin for vtt output. input voltag e may range up to 1.8v, but consideration must be given to the current limit dictated by the on-resistance of the ic and the change in allowable loss due to input/outpu t voltage difference. take note that a high-impedance voltage input at vtt_in m ay result in oscillation or degradation in ripple rejec tion, so connecting a 10f capacitor with minimal change in capacitance to vtt_in terminal is r ecommended. however, the impedance may depend on the characteristics of the power s upply input and the impedance of the pc board wiring, which must be carefully checked before use. 3. vtt vtt is the output pin for the ddr memory termination voltage and it has a sink/source current capability of 1.8a. the output voltage is same as ref voltage. the output is turned to off when ref pin is low or wh en either the vcc uvlo or thermal shutdown protection function is activated. always connect a capacitor to vtt pin for a loop gain and phase compensation and a reduction in output voltage variation in the event of sudden load change . be careful in choosing the capacitor as insufficient cap ac it ance may cause an oscillation and high esr (equivalent series resista nce) may result in increased output voltage variation during a sudden change in load. a 10 f or so ceramic capacitor is recommended, though ambient temperature and other conditions sh ould also be considered. a low esr ceramic capacitor may reduce a loop gain phase margin and may cause an oscillation, which may be improved by con necting a resister in series with the os - capacitor (several - hundred f). 4. ref a high input of 0.6v or higher to ref turns on the vtt output. a low input of 0.15 v or less, on the other hand, turns vtt to a hi -z state. pin no. pin name pin function 1 vtt_in termination power supply pin 2 gnd ground pin 3 ref reference voltage output pin 4 v tt termination output pin 5 n.c non connection 6 vcc vcc pin 7 n.c non connection 8 n.c non connection n.c n.c vtt_in gnd ref vtt n.c vcc 1 2 3 4 5 6 7 8 top view downloaded from: http:///
3/ 15 bd3537f ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900970-1-2 02.nov.2015 rev.001 absolute maximum ratings parameter symbol limit unit input voltage v cc 7 (note 1) v ref input voltage v ref 7 (note 1) v termination input voltage v vtt_in 7 (note 1) v output current i vtt 1.8 a power dissipation1 pd 1 0.56 (note 2) w power dissipation2 pd 2 0.69 (note 3) w operating temperature range topr - 30 to + 100 c storage temperature range tstg - 55 to +1 50 c maximum junction temperature tjmax +150 c (note 1) should not exceed pd. (note 2) derate by 4.48mw /c for ta over 25 c (no heat sink). (note 3) derate by 5.52mw /c for ta over 25 c (when mounted on 70mm x 70mm x 1.6mm glass-epoxy pcb ). caution: operating the ic over the absolute maximum ratings may dam age the ic. in addition, it is impossible to predict all destructive situa tions such as short-circuit modes, open circuit modes, etc. therefore, it is importan t to consider circuit protection measures, like adding a fuse, in case the ic is operated in a special mode exceeding the absolute maximum ratings recommended operating conditions (ta=25 c ) parameter symbol min max unit input voltage v cc 4.75 5.25 v termination input voltage v vtt_in 1.746 1.854 v reference voltage v ref 0.6 1.6 v electrical characteristics (unless otherwise noted, ta=25 c , v cc =5v, v ref =0.9v, v vtt_in =1.8v) parameter symbol standard value unit conditions min typ max standby current i st - 50 90 a v ref <0.15v(shutdown) bias current i cc - 1 2.5 ma v ref =0.9v [termination] termination output voltage 1 v v tt1 v ref - 20m v ref v ref +20m v i v tt =0a termination output voltage 2 v v tt2 v ref - 20m v ref v ref +20m v i v tt =-1.8a to +1.8a source current i v tt+ 1.8 - - a sink current i v tt - - - -1.8 a upper side on-resistance 1 r hron1 - 0.3 0.5 lower side on-resistance 1 r lron1 - 0.3 0.5 [uvlo block] uvlo threshold voltage v uvlo 3.5 3.8 4.1 v vcc : sweep up uvlo hysteresis voltage ? v uvlo 100 160 220 mv vcc : sweep down [enable block] en -on voltage v e nh 0.6 - - v en -off voltage v enl - - 0.15 v downloaded from: http:///
4/ 15 bd3537f ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900970-1-2 02.nov.2015 rev.001 typical waveforms figure 2. ddri (+ 1a -1a) v v tt (50mv/div.) i v tt (1a/div.) figure 3. ddr ii (- 1a +1a) v v tt (50mv/div.) i v tt (1a/div.) figure 1. ddri (- 1a +1a) v v tt (50mv/div.) i v tt (1a/div.) figure 4. ddr ii (- 1a +1a) v vtt (50mv/div.) i vtt (1a/div.) downloaded from: http:///
5/ 15 bd3537f ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900970-1-2 02.nov.2015 rev.001 typical waveforms C continued figure 5. input sequence 1 vtt ref vtt_in vcc figure 6. input sequence 2 vtt ref vtt_in vcc figure 7. input sequence 3 vtt ref vtt_in vcc figure 8. sof t start v ref (500mv/div) v v tt (500mv/div) i vtt_ in (50ma/div) (100sec/div) downloaded from: http:///
6/ 15 bd3537f ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900970-1-2 02.nov.2015 rev.001 typical performance curves figure 10 . terminal output voltage vs output current (ddr- ii) 0.896 0.898 0.900 0.902 0.904 0.906 0.908 0.910 0.912 -2 -1 0 1 2 itt(a) vtt(v) output current : i v tt (a) terminal output voltage : v v tt (v) figure 9 . terminal output voltage vs output current (ddr-i) 1.244 1.246 1.248 1.250 1.252 1.254 1.256 1.258 -2 -1 0 1 2 itt(a) vtt (v) output current : i v tt (a) terminal output voltage : v v tt (v) downloaded from: http:///
7/ 15 bd3537f ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900970-1-2 02.nov.2015 rev.001 application information 1. soft start function (1) when input ref voltage (2) when input vcc voltage (3) when input vttin voltage vcc ref vttin vtt vcc ref vttin vtt vcc ref vttin vtt t soft t soft (note) t soft 1msec include soft start include soft start en shutdown (0.6v/typ) uvlo released (3.8v/typ) no soft start downloaded from: http:///
8/ 15 bd3537f ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900970-1-2 02.nov.2015 rev.001 2. ev aluation board bd3537f evaluation board circuit bd3537f evaluation board application components ? `` ? `` u1 rohm bd3537f c 8 m 0 c 9 10f kyocera cm316b106m10a m 1 c 10 c 1 r 1 100k rohm mcr03 c 2 10 f kyocera cm 316b106m10a r 2 100k rohm mcr03 c 3 1f kyocera cm05b105k10a r 3 c 4 r 4 c 5 1f kyocera cm05b105k10a r 5 c 6 r 6 c 7 bd3537f (sop8) evaluation board layout bd3537f vttin ref vcc gnd vtt vtt sw vttin vddq vref en v cc gnd vcc gnd gnd u1 c 10 c 7 c 8 c 9 r 3 c 11 r 4 gnd gnd c 1 c 2 r 1 r 2 c 6 c 5 c 3 c 4 1 3 6 2 4 m 1 m 0 c 12 c 13 silk screen top layer bottom layer downloaded from: http:///
9/ 15 bd3537f ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900970-1-2 02.nov.2015 rev.001 3. power dissipation in thermal design, consider the temperature range where ic is guaranteed to operate and appropriate margins. the temperature conditions that need to be considered are listed below: (1) ambient temperature ta: 100c or lower (2) chip junction temperature tj: 150c or lower the chip junction temperature tj can be considered as follows: most of heat loss in bd353 7f occurs at the output n-channel fet. the lost power is de termined by multiplying the voltage between in and out by the output current. since this ic is packaged for high-power applications, its thermal derating characteristics significantly depend on the pcb. so when designing, the size of the pc b to be used should be carefully considered. power dissipation (w) = {input voltage (v v tt _ in ) C output voltage (v v tt = v ref )} x i out (ave) if v vtt_in =1.8v , v ref = 0. 9v, and i out (ave)=0.5a, for instance, the power dissipation is determined as fo llows: ? ? 0.4(w) = 0.5(a) (v) 0.9 - (v) 1.8 = (w) n consumptio power ? sop8(bd3537f) (1) 70mm x 70mm x 1.6mm glass-epoxy pcb j -c=181c/w (2) with no heat sink j -a=222c/w 150 [ c ] 0. 60 0 25 75 100 125 50 0. 20 0. 10 0 0. 40 0. 50 0. 30 [w] (2) 0. 56w 100 c (1) 0. 69w power dissipation [pd] 0. 70 ambient temperature [ta] downloaded from: http:///
10 / 15 bd3537f ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900970-1-2 02.nov.2015 rev.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an externa l diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance supp ly lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the groun d and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all powe r supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-si gnal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short an d thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding thi s absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristic s of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that th e internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequen ce and delays, especially if the ic has more than one po wer supply. therefore, give special consideration to power cou pling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors compl etely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when moun ting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as m etal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos tra nsistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise sp ecified, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
11 / 15 bd3537f ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900970-1-2 02.nov.2015 rev.001 operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate l ayers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a para sitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physica l damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 11. example of monolithic ic structure 13. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that preven ts heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a contin ued period, the junction temperature (tj) will exceed 175 c which will activate the tsd circuit that will turn off al l output pins. when the tj falls below the tsd threshold, the circuits are automatically restore d to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other than protecting the ic from heat damage. 14. capacitor across output and gnd if a large capacitor is connected between the output pin a nd ground pin, current from the charged capacitor can flow into the output pin and may destroy the ic when the vcc or in pin is shorted to ground or pulled down to 0v. use a capacitor smaller than 10 00 f between output and ground. 15. output capacitor do not fail to connect a output capacitor to v tt output terminal for stabilization of output voltage. the outpu t capacitor works as a loop gain phase compensator and an output v oltage variation reducer in the event of sudden change i n load . insufficient capacitance may cause an oscillation. and if the equivalent series resistance (esr) of this capacitor is high, the variation in output increases in the event of sud den change in load. it is recommended to connect a 10 f or so ceramic capacitor, though it depends on ambient tempe rature and load conditions. it is therefore requested to carefully check under the actual temperature and load condit ions to be applied. 16. input capacitor s setting these input capacitors are used to reduce the output impeda nce of power supply to be connected to the input terminals (vcc and vtt_in). increase in the power supply output im pedance may result in oscillation or degradation in ripple rejecting characteristics. it is recommended to u se a low temper ature coefficient 1f (for vcc) and 10f (for vtt_in) capacitor, but it depends on the characteristics of the p ower supply input, and the capacitance and impedance of the pc board wiring pattern. it is therefore requ ested to carefully check under the actual temperature and load conditions to be applied. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
12 / 15 bd3537f ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900970-1-2 02.nov.2015 rev.001 operational notes C continued 17. input terminals (vcc, vtt_in and re f) vcc, vtt_in and ref terminals of this ic are made up independen t one another. to vcc terminal, the uvl o function is provided for malfunction protection. irrespective o f the input order of the inputs terminals, vtt output is activated to provide the output voltage when uvlo voltages reach the threshold voltage while ref voltage reaches the threshold of en. 18. ref pin ref pin controls this ic s status on or off. when ref voltage reaches en-on voltage, the output volt age operates. 19. operating range within the operating range, the operation and function of the circuits are generally guaranteed at an ambient temperature within the range specified. the values specifi ed for electrical characteristics may not be guaranteed, but drastic change may not occur to such characteristics within the operating range. 20. thermal shutdown circuits this ic incorporates a built- in -thermal shutdown circuit, to preven t the ic from thermal breakdown. in thermal shutdown circuit operation, vtt output to be off. the thermal shutdown circuit is originally designed to protect the incorporated ic i so that thermal design needs to be desi gned below the temperature, which ena bles to run the thermal shutdown circuits. 21. in the event that a load containing a large inductance component is connected to the output terminal, and generation of back-emf at th e start-up and when output is turned off is assumed, it is requested to insert a protection diode. 22. application circuit although w e can recommend the application circuit contained herein with a relatively high degree of confidence, we ask that you verify all characteristics and specifications o f the circuit as well as its performance under actual conditions. please note that we cannot be held responsible for p roblems that may arise due to patent infringements or noncompliance with any and all applicable law and regulations . output pin (example) downloaded from: http:///
13 / 15 bd3537f ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900970-1-2 02.nov.2015 rev.001 ordering information b d 3 5 3 7 f - e 2 part number package f : sop8 packaging and forming specification e2: embossed tape and reel marking diagram sop8 (top view) d 3 5 3 7 part number marking lot number 1pin mark downloaded from: http:///
14 / 15 bd3537f ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900970-1-2 02.nov.2015 rev.001 physical dimension, tape and reel information package name sop8 (unit : mm) pkg : sop8 drawing no. : ex112-5001-1 (max 5.35 (include.burr)) downloaded from: http:///
15 / 15 bd3537f ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900970-1-2 02.nov.2015 rev.001 revision history date revision changes 02.nov.2015 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation depending on ambient temperature. when used in sealed area, c onfirm that it is the use in the range that does not exceed t he maximum junction temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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